Thermal Conductive Soft Pads are specially designed for the purpose of high performance thermally conductivity to solve some of most difficult thermal problems. The material is used to conform to the irregular surface under moderate application pressures. The products are widely applied in electronic parts such as IC, CPU, LED, laptops, PC, DVD application and so on. It has been also used in memory modules, heat pipe assemblies, voltage regulators and automotive electronics. Fiberglass carrier can be added for improved mechanical strength and also provides an adhesive for improved application performance.
The very flexible structure and low hardness allow great adaptively to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. The surface of the pad is equipped with a protective foil which needs to be removed before use.
The pads can be used on VRAM modules on graphics cards as well as on the VRM modules on a Mainboard or almost any other application where a high-performance thermal interface is desired. Even elements with large surfaces such as North- or Southbridge on a Mainboard are no problem for this thermal pad as it has great thermal conductivity
IC thermal pad is a kind of thermal conductive medium material synthesized by adding metal oxide and other auxiliary materials to silicone as the base material through a special process. In the electronic industry, it is also called CPU & GPU thermal conductive pad, CPU thermal conductive silicone sheet, CPU soft thermal pad, etc. It mainly plays the role of heat transfer in IC high temperature products. The finished product of IC thermal conductive silicone sheet has good insulation, mechanical, sealing, non-deformability, corrosion resistance and other characteristics. The main purpose of choosing IC thermal conductive silicone sheet is to reduce the contact thermal resistance between the surface of IC heat source and the contact surface of heat dissipation device. The thinner the thickness, the smaller the thermal resistance. IC thermal conductive silicone sheet is specially produced for the design scheme that uses gap to transfer heat. It can fill the gap, complete the heat transfer between the heating part and the IC heat dissipation part, and also play the role of insulation, shock absorption, sealing, etc. It can meet the design requirements of miniaturization and ultra-thin of electronic devices. It is a very excellent thermal conductive and insulating filling material with wide thickness range and high processability and usability.
