◇ 3.0 W/mk Thermal Conductivity,Good Thixotropism
◇ Soft and ultra high compressibility for low stress applications
◇ Higher viscosity compound than grease, it eliminates the bleed,
separation,pump-out & dirtly other parts usually associated with grease.
Typical Application:
◇ Between heat-generation Conponment and and heatsink.
◇ Automotive engine control, Graphices Cards, Telecom device.
◇ Wireless Hub,Military equipment, power supply.
◇ Entire large panel PCB Cooling
◇ Any high compression low stess application
| Typical Properties of Thermal Conductive Putty/Gel | ||||||
| Properties | Units | TCP300P | TCP300G | Test Method | ||
| Color | --- | White or Light Blue | White or Light Blue | Visual | ||
| Min. BondlineThickness (mm) | NA | 0.1 | --- | |||
| Thickness | mm | 1.0 to 5.0 | NA | --- | ||
| Density(g/cm) | --- | 2.88 | 2.88 | ASTM D792 | ||
| Hardness (Shore ) | 00 | 5 | NA | ASTM D2240 | ||
| Viscosity(@0.5rpm) | NA | 4000000 | ASTM D2240 | |||
| Temperature Range | ℃ | -40 to 200 | -40 to 200 | EN344 | ||
| Volume Impedance | ohm-cm | 5 x1014 | 1 x1013 | ASTM D150 | ||
| Thermal Conductivity | W/m.k | 3.0 | 3.0 | ASTM D5470 | ||
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