High thermal conductivity interface materials play an important role in addressing thermal management issues. Thermal management has become a 'hot' field in recent years due to a need to obtain high performance levels in many devices used in such diverse areas as space science, mainframe and desktop computers, optoelectronics and even Formula One racing cars!
TCP series thermal pad from SinoGuide Engneering Development are ntended to minimize the thermal barrier that exists between the surface of a microprocessor, for example, and an attached heat-sink. Measurement of this barrier is generally expressed as a value for thermal resistance between two mating surfaces (semiconductor case and heat-sink base). Minimizing the resistance value reduces potential for semiconductor overheating, resulting in increased reliability during system operation and increased life. Excessive operating temperature is generally acknowledged as the cause of early component failure. The amount of power dissipated as waste heat due to inefficiency at the device level can range from a fraction of a watt to tens or hundreds of watts, depending on the specifics of the semiconductor and the intended operation.
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