Features and Benefits
◇ 2.00 W/mk thermal conductivity
◇ Silicone-Free Thermal Pad
◇ Naturally tacky for easy applicaiton
◇ Electrically insulating
Typical Application:
◇ Network Equipement, Mass Storage devices
◇ Industrial Automation, Telecom Device.
◇ Smart TV Stick, Wireless Hub,Flat Panel displays, Power supply.
| TYPICAL PROPERTIES OF TCSF200 | ||
| PROPERTY | METRIC VALUE | TEST METHOD |
| Composition | Acrylic | ---- |
| Color | Grey | Visual |
| Thickness (mm) | 0.5 to 5 | ---- |
| Hardness (Shore 00) | 60 | ASTM D2240 |
| Density (g/cc) | 3.13 | ASTM D792 |
| Heat Capacity(1/g-K) | 1.1 | ASTM E1269 |
| Outgassing TML | 0.12% | ASTM E595 |
| Outgassing CVCM | 0.06% | ASTM E595 |
| Continuous Use Temp (℃) | -60 to 200 | EN344 |
| ELECTRICAL | ||
| Dielectric Breakdown Voltage (Vac) | ≥200 Vac/mil | ASTM D149 |
| Volume Impedance (ohm-cm) | 6.0 x109 | ASTM D257 |
| Flame Rating | V 0 | UL 94 |
| THERMAL | ||
| Thermal Conductivity (W/m.k) | 2.0 | ASTM D5470 |
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