Features and Benefits
-All of our Thermal Conductive Adhesive Tape is used for bonding heat disspation fins to microprocessor or power consumption semiconductors, utlimate bonding strength with lower thermal resistance without mechanical fixing for assembly
-Double-sided, pressure sensitive adhesive tape
-Electrically insulating
Typical Application:
- Mount heat sink/spreader onto drive process(BGA)/power converter or Motor control PCB
- In all applications where a metal/plastic housing is used as heatsink without screw or clip mounting and hot-melt glue
| Typical Properties of Thermal Conductive Adhesive Tape | ||||||||
| Properties | Units | TCT120 | TCT120FG | Test Method | ||||
| Color | --- | White | White | Visual | ||||
| Reinforcement Carrier | --- | No | Fiberglass | --- | ||||
| Thickness Range | mm | 0.15 | 0.25 | 0.15 | 0.2 | 0.25 | 0.3 | --- |
| natural tacky (1- or 2-sided) | --- | 2 | 2 | 2 | 2 | 2 | 2 | --- |
| Continuous Use Temp | ℃ | -20 to 100 | EN344 | |||||
| ELECTRICAL | ||||||||
| Breakdown Voltage | Kv/mm | ≥2 | ≥4 | ≥2 | ≥2.5 | ≥3.5 | ≥4 | ASTM D149 |
| Peel Adhesion | N/25mm | 9.5 | 11 | 10.3 | 11.8 | 14.5 | 15.8 | PSTC-7 |
| Holding Adhesion | N/25mm/25℃ | 10.2 | 11.8 | 12.2 | 14.5 | 16.8 | 18 | PSTC-7 |
| THERMAL | ||||||||
| Thermal Conductivity | W/m.k | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | 1.2 | ASTM D5470 |
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