High Performance Thermally Conductive gap filler pads from SinoGuide Engneering Development. Ultra High Thermally Conductive Pads with Exceptional Dielectric Strength.
Features and Benefits
All thermal conductive pad are used to fill in air gaps between heat-generating electronic component and heatsinks,metal housing or chassis for intimate contact over rough or uneven surface textures to eliminate air gaps and reduce thermal resistance with high compliance.
All thermal conductive pad series is very cost-effective materials which is made through advanced manufacturing process and with meeting the requirement of UL 94 V0 , RoHs and Reach compliance.
Typical Application:
'- Be required to be used btw heat-generating electronic components such as semiconductor, IC, CPU.MOS and heatsink/housing
- ECU, Telecom device, wireless Hub, power supply, converter/inverter, Battery etc.
- Cooling or thermal Module, in all applications where a metal housing is used as heatsink.
| Typical Properties of Thermal Conductive Pad | ||||||||||
| Properties | Units | TCP100 | TCP150 | TCP200 | TCP300 | TCP500 | TCP600 | TCP750 | TCP110U | Test Method |
| Color | --- | Gray | Black | Dark Gray | Blue | Pink~Violet | Light Blue | Violet | pink/white | Visual |
| Reinforcement Carrier | --- | — | — | — | — | — | — | — | Fiberglass | --- |
| Thickness Range | mm | 0.25~15 | 0.25~15 | 0.25~15 | 0.25~15 | 0.25~15 | 0.3~10 | 1.0~10 | 0.5~10 | --- |
| natural tacky (1- or 2-sided) | --- | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 1 | --- |
| Hardness | Shore C | 25,35 | 15,25,35 | 15,25,35 | 25,35 | 30 | 30 | 50 | 5, 15 | ASTM D2240 |
| Density | g/cc | 1.8 | 2.2 | 2.4 | 2.6 | 3 | 3.6 | 3.8 | 2.0 | ASTM D792 |
| Continuous Use Temp | ℃ | -40 to 200 | EN344 | |||||||
| ELECTRICAL | ||||||||||
| Breakdown Voltage | Kv/mm | ≥9 | ≥9 | ≥9 | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ≥6.0 | ASTM D149 |
| Volume Impedance | ohm-cm | ≥4x1012 | ≥5x1012 | ≥3.6x1013 | ≥1.1X1014 | ≥1.1X1014 | ≥6.5X1010 | ≥6.5x1010 | ≥6.2X1015 | ASTM D257 |
| Dielectric Constant | 1MHz | 5.27 | 5.2 | 6 | 6.8 | 6.6 | 6.5 | 6.8 | 5.5 | ASTM D150 |
| Flame Rating | --- | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | UL 94 |
| THERMAL | ||||||||||
| Thermal Conductivity | W/m.k | 1.0 | 1.5 | 2.0 | 3.0 | 5.0 | 6.0 | 7.5 | 1.1 | ASTM D5470 |
Note: "D" suffix: one side tacky and non-tacky on the other side
"A1" suffix: Additional adhesive on one side, "A2" suffix: Additional adhesive on both sides
"M" suffix: Fiberglass reinforcement in the middle layer for all the size if required
"F" suffix: Fiberglass reinforcement on top or bottom layer
Standard sheet: 200x400mm,300x300mm,Custom configuration Available
Thermal Conductive Pad TCP100
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Thermal Conductive Pad TCP150
Conformable, Thermally Conductive Material for Filling Air Gaps
Thermal Conductive Pad TCP200
Thermally Conductive, Unreinforced Gap Filling Material
Thermal Conductive Pad TCP300
High Performance, Thermally Conductive Gap Filling Material
Thermal Conductive Pad TCP500
High Thermal Conductivity, High Performance, Thermally Conductive Gap Filling Material
Thermal Conductive Pad TCP600
High Performance, Thermally Conductive Gap Filling Material
Thermal Conductive Pad TCP750
Very High thermal conductivity plus "S-Class" softness and conformability.
Learn More Our Thermal Pad Materials: http://www.sg-thermal.com/Thermal-Pad/
Tel.:+86-755-89375091 Fax.:+86-755-89375092 E-mail: Info@sinoguidetech.com
Address: 19H Maxgrand plaza, No.3 Tai Yau Street, San Po Kong, Kowloon Hong Kong
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