Thermally conductive insulators are designed to be clean, grease-free, flexible and convenient assembly .The combination of a tough carrier material such as fiberglass or Polyimide and silicone rubber which is conformable, minimize the thermal resistance from the case of a power semiconductor such as MOSFET to the heat sink.
All TCI materials electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also strong enough to resist puncture by the facing metal surface by screw driver and clip mounted application
Typical Application:
-Between high power component (such as MOSFET) and heatsink for screw and clip mounted application
-Graphic Processor Unit
-Power Semiconductors
-Digital/High Power CPU's
| Typical Properties of Thermal Conductive Insulator | |||||||
| Properties | Units | TCI160F | TCIK10 | TCI160 | Test Method | ||
| Carrier | --- | Fiberglass | Polyimide(Kapton) | NA | --- | ||
| Color | --- | Grey/Pink | Beige | Black | Visual | ||
| Thickness | mm | 0.229,0.3,0.45 | 0.16 | 0.2~0.80 | --- | ||
| Thickness Tolerance | +/-0.02mm | +/-0.02mm | +/-0.02mm | --- | |||
| Hardness | Shore A | 80 | 80 | 80 | ASTM D2240 | ||
| Density(g/cm) | --- | 2.2 | 2.3 | 2.00 | ASTM D792 | ||
| Temperature Range | ℃ | -50 to 200 | EN344 | ||||
| Breakdown Voltage | KV | ≥4.8 | ≥5.0 | ≥5.0 | ASTM D149 | ||
| Dielectric Constant | 60 HZ | 3.6 | 3.75 | 6.6 | ASTM D150 | ||
| Dielectric Constant | 1K Hz | 3.5 | 3.7 | 6.6 | ASTM D150 | ||
| Dielectric Constant | 1M Hz | 3.5 | 1.8 | 6.6 | ASTM D150 | ||
| Thermal Conductivity | W/m.k | 1.6 | 1.3 | 1.6 | ASTM D5470 | ||
Note: Standard Roll Form: 300mm(W) x 50m (L) or 76M (L) , Custom configuration Available
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